Boston Micro Fabrication (BMF) has introduced four new materials for its microArch series 3D printers. These advanced materials were designed to further enhance BMF's ability to meet the diverse and demanding needs of industries like aerospace, medical devices, electronics, and biotechnology. By adding these advanced materials to the lineup, BMF intends to help engineers and researchers create fit-for-purpose precision parts with unprecedented accuracy, heat resistance, and material performance. 

New materials now available include: 

3D Systems Figure 4 HI TEMP 300-AMB 
Ideal for extreme thermal environments, this production-grade, ultra-high temperature resistant plastic offers a Heat Deflection Temperature (HDT) of over 300°C. With excellent rigidity and visualization properties, Figure 4 HI TEMP 300-AMB is perfect for HVAC components, motor enclosures, and low-pressure molding, offering precise testing of high-temperature parts. 

Applications: HVAC systems, consumer appliances, motor enclosures, and low-pressure molding. 

Key Benefits: HDT over 300°C, no secondary thermal post-cure required, and superior rigidity. 
 

BASF Ultracur3D 3280 
A ceramic-filled resin that boasts exceptional stiffness (Young's modulus of 10 GPa) and a high Heat Deflection Temperature (>280°C), Ultracur3D 3280 is ideal for tooling, molding, and wind tunnel testing. Its low viscosity and stable suspension make it both easy to handle and print, positioning it as a standout material in the field of high-temperature and high-stiffness applications. 

Related:How to Build Tiny Products by Using Microfabrication Techniques

Applications: Tooling, wind tunnel testing, and mold inserts. 

Key Benefits: Superior stiffness and temperature performance, high stability, and easy to print. 
 

HTF (High-Temp) 
Designed by BMF, HTF is a high-temperature resistant, tough, and biocompatible resin. It is autoclave-sterilizable and ideal for applications where biocompatibility and flexibility are key. With an HDT of 152°C and compatibility with aerospace and biotech applications, HTF offers versatility across a range of demanding environments. 

Applications: Aerospace, precision electronics, and biotechnology. 

Key Benefits: Biocompatibility, autoclave sterilizable, and higher flexibility than comparable materials. 
 

Image courtesy of Boston Micro Fabrication

SR (Sacrificial Resin) 
A soluble, sacrificial material, SR enables the creation of single-use molds for parts produced with other materials that cannot be easily printed, such as polypropylene (PP) or polyoxymethylene (POM). This material opens new possibilities for prototyping and low-volume production by reducing the cost and complexity of micro-injection molding. 

Related:Industry Voices: Is Micro-3D Printing the Future for Tiny Parts?

Applications: Single-use molds, low-volume part production, and PDMS applications. 

Key Benefits: Dissolves in a sodium hydroxide solution and facilitates cost-effective part production. 

Unlocking possibilities for micro manufacturing 

Each of these materials complements the unique capabilities of BMF's microArch 3D printers, ensuring that industries like medical devices, electronics, and aerospace can continue to push the boundaries of what's possible with micro-scale 3D printing.

Many of the BMF materials are specifically designed for micro molding. "Before discovering BMF, Makuta struggled to find a cost-effective solution for prototyping due to the size and complexity of their molded parts,” said Taki Yamada, director of business development at Makuta, a micro molding company. “Traditional methods like aluminum or urethane molds often fell short in holding the required tolerances, and the expense of creating entirely new molds was prohibitive.”

The new materials open up new product possibilities for companies like Z-Axis Connector Company, a business that makes elastomeric connectors. "Boston Micro Fabrication’s micro-precision 3D printing technology has completely transformed how we approach connector manufacturing,” said George Glatts, owner of Z-Axis Connector Company. “Previously limited to tolerances of 5 thousandths with traditional methods, BMF allowed us to achieve tolerances of 1 to 2 thousandths, opening new possibilities for compact, high-performance connectors. Their platform also enabled us to use 3D Systems Figure 4 HI TEMP 300-AMB material that can withstand temperatures up to 300°C, meeting the demands of standard electronic assembly processes, enhancing efficiency and allowing us to create more compact, innovative designs.”