Embedded technology is the key to development of many products and technologies today, and the annual Embedded World Exhibition and Conference in Germany is an eagerly-anticipated annual event. But this year, a version of the show for North America has been launched, in the form of Embedded World North America. Taking place through October 10 at the Austin Convention Center in Austin, Tx, the show gathers many key players in embedded hardware and software in a display of the latest technology and providing a networking forum for the exchange of ideas.

Being a new show, Embedded World North America is scaled down a bit from its established European counterparts. Nevertheless, some major suppliers of embedded technology will exhibit there, demonstrating interesting products and technologies. A sampling of announcements follows below.

Wi-Fi from a RJ45 Connector

Taoglas, which supplies antennas and IoT components, has unveiled AntJack, a high-efficiency Wi-Fi antenna that is mounted on a standard RJ45 ethernet connector. The FXM100* Wi-Fi antenna can be mounted on Taoglas’ TMJG4926HENL or any standard 1x1 RJ45 connector to create a 2-in-1 solution, providing designers space-saving options and layout flexibility to improve wireless coverage across 2.4 GHz, 5.8 GHz, and 7.1 GHz bands.

Related:Embedded World Shows Future of Embedded Systems

By mounting the antenna on the jack, the antenna is removed from the PCB freeing up valuable real estate and uses the jack as the antenna ground plane to deliver better wireless performance. The FXM100 omnidirectional dipole antenna supports Bluetooth, Wi-Fi 6 / 6E, and Wi-Fi 7 and can be used in industrial robotics, and test and measurement systems.

AntJack is also ideal for complex MIMO designs where antenna location and positioning are critical, especially when space is a premium in 4x4 or 8x8 MIMO configurations. In addition to layout constraints, designers are often forced to work around proximity to metal which causes interference and signal distortion.

The AntJack antenna will be on display with Taoglas products in booth #2327 at Embedded World North America.

Edge AI computing platform

NEXCOM is its demonstrating AI-X platform, which according to the company simplifies GenAI and LLM deployment and management at the edge, providing organizations with a powerful and flexible language model assistant and knowledge-based answer and responses. It integrates retrieval-augmented generation (RAG) functionality, enabling AI-X to reference internal knowledge bases uploaded by users. This functionality is particularly valuable for industries requiring stringent IP protection.

Related:All Things Embedded Come Together at Embedded World

The AI-X platform is designed for easy deployment, featuring a GPT-like web interface for streamlined device configuration, smart dashboards for system monitoring, and granular user permissions for enhanced data control. Running locally on the network edge, AI-X reduces the security risks associated with cloud-based AI systems, providing offline capabilities that ensure data privacy and security.

NEXCOM is also announcing its ATC 3750-IP7-6C ruggedized computer designed for autonomous machines and powered by the NVIDIA Jetson™ platform for edge AI and robotics. The ATC 3750-IP7-6C is designed to deliver 200 to 275 TOPS for AI processing and inference workloads. It features 6 PoE+ with an optional 10GbE port for high-speed data transmission for seamless access to IP CAM, along with a variety of rich peripheral ports including GbE/2.5GbE, USB3.2, isolation CANBus, RS232, Console, DI/DO, OTG, and HDMI. The PoE+ port provides a high-speed connection for autonomous machines, enabling communication between various sensors, including high-resolution cameras, lidar, and radar, and the processing unit. 5G and Wi-Fi options also enable over-the-air collaboration with cloud systems for AI model retraining.

NEXCOM will exhibit at booth #2505.

SECO’s computing solutions  

SECO, a global provider of end-to-end solutions for embedded computing, will demonstrate a comprehensive development kit designed to expedite product development and software testing for IoT and edge AI applications. This versatile platform provides the necessary tools to exploit the performance and connectivity capabilities of the company’s SOM-SMARC-QCS6490 computing module, based on the Qualcomm QCS6490 processor. The kit includes the SOM-SMARC-QCS6490 configured with 8GB LPDDR4 memory, 128GB UFS storage, and a Wi-Fi radio, paired with a 3.5” form-factor carrier board that supports a cellular modem via an mPCIe slot with a nano SIM holder, and a heatsink. The kit also includes an LCD display with a capacitive touch panel, a debug cable, Wi-Fi antenna, a boot/rescue SD card, an ethernet cable, and a 12V power supply. For enhanced functionality, optional accessories such as MIPI-CSI cameras are also available. 

The kit facilitates interconnected application development with Clea, SECO’s software suite for the Internet of Things. Working with any cloud provider and scalable from small to large widely distributed enterprise deployments, Clea easily enables device management features, remote over-the-air updates, complex data analysis on the SMARC itself, and communication to the cloud as needed.  

At SECO’s booth #2315, the company will also demonstrate the company’s capabilities for edge AI development and deployment, utilizing a Qualcomm® application processor to run a Large Language Model (LLM) at the edge. The demo, which could be tailored for the medical field, illustrates the interaction with devices, efficient edge operation, and data privacy protection – even with limited computational resources.

SFF industrial computer

Premio Inc., has launched its newest addition to the flagship line of RCO Series x86 Super-Rugged Small Form Factor (SFF) Industrial Computers, the RCO-3000-RPL Series. Engineered for powerful real-time processing performance with 13th Gen Intel^® Core™ processors, this next-generation SFF industrial computers offers IoT connectivity, modular EDGEBoost I/O scalability, The RCO-3000-RPL Series is being shown at Premio’s booth #2133.

Core platform

Secure-IC is introducing its new product range Securyzr neo. This enhanced version of the widely silicon-proven Securyzr now features the Securyzr neo Core Platform, which allows a range of product configurations—whether through iSEs, Crypto co-processors, or standalone Ips. The cores’ flexibility allows Secure-IC Customers to implement tailored security solutions that align with their industry’s unique technical and performance requirements, ensuring optimal protection across a wide variety of applications.

The core platform and other Secure-IC products are on display in booth #2338.

Embedded & digital solutions

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MosChip® will show its recently launched “MosChip DigitalSky™ - Building Connected Intelligent Enterprises at booth #2054

Computer systems for harsh environs

Neousys, in booth 1937, will exhibit rugged fanless systems with Intel 14th-Gen Core™ and NVIDIAJetson platforms, including Waterproof and EdgeAI solutions designed for harsh environments.

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Development board

Particle, in booth #2333, will show its Tachyon 5G SBC and Muon multi-radio dev board.

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